INTEL AND ERICSSON are teaming up to bring High Speed Packet Access (HSPA) to mobile Internet devices (MIDs). Ericsson also announced it would extend its 3G mobile broadband from notebooks to a plethora of other pocket devices.
The move was announced at the Intel Developer Forum in Taiwan by Intel's senior veep and Ultra Mobility Group general manager, Anand Chandrasekher.
Chandrasekher gushed about the progress Chipzilla was making in the MID market and demonstrated the 'Moorestown' platform at work for the first time.
Made up of a System on a Chip (SOC), dubbed 'Lincroft', Moorestown integrates a 45nm processor, graphics, memory controller and video encoder/decoder on a single chip. It also boasts an I/O hub, 'Langwell', to connect I/O ports with wireless, storage and display components as well as a fair few board level functions.
Noting that Moorestown would be a catalyst for pushing the “full Internet experience” into the smartphone space, Chandrasekher said Moorestown platforms would support a whole multitude of wireless technologies including 3G, WiMAX, WiFi, GPS, Bluetooth and even mobile TV.
He added Intel was was well on track for bringing Moorestown’s idle power down by over ten times that of the first-generation MIDs based on the Atom processor.
Discussing the Ericsson partnership, Chandrasekher said HSPA data modules - sized 25×30×2.x mm - had been optimised for the Moorestown platform and was scheduled for release in 2009/10.
In another announcement, Chandrasekher noted that wireless technology company, Option, was also extending its collaboration for HSPA modules to the Moorestown platform with a new 3.5G HSPA embedded module.
The move was announced at the Intel Developer Forum in Taiwan by Intel's senior veep and Ultra Mobility Group general manager, Anand Chandrasekher.
Chandrasekher gushed about the progress Chipzilla was making in the MID market and demonstrated the 'Moorestown' platform at work for the first time.
Made up of a System on a Chip (SOC), dubbed 'Lincroft', Moorestown integrates a 45nm processor, graphics, memory controller and video encoder/decoder on a single chip. It also boasts an I/O hub, 'Langwell', to connect I/O ports with wireless, storage and display components as well as a fair few board level functions.
Noting that Moorestown would be a catalyst for pushing the “full Internet experience” into the smartphone space, Chandrasekher said Moorestown platforms would support a whole multitude of wireless technologies including 3G, WiMAX, WiFi, GPS, Bluetooth and even mobile TV.
He added Intel was was well on track for bringing Moorestown’s idle power down by over ten times that of the first-generation MIDs based on the Atom processor.
Discussing the Ericsson partnership, Chandrasekher said HSPA data modules - sized 25×30×2.x mm - had been optimised for the Moorestown platform and was scheduled for release in 2009/10.
In another announcement, Chandrasekher noted that wireless technology company, Option, was also extending its collaboration for HSPA modules to the Moorestown platform with a new 3.5G HSPA embedded module.
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