Leading microprocessor manufacturer Intel Corp. has today unveiled plans for a range of highly integrated, purpose-built and Web-savvy System on Chip (SoC) designs and products targeted specifically at the growing wealth of computers and other electronic devices that come equipped with Internet access.

According to Santa Clara-based Intel, several of its new and emerging SoC chip designs are based on the company’s mobile Atom core and have evolved from the same blueprint used to create existing Intel processors responsible for running the bulk of the Internet (better known as Intel Architecture or IA).

By applying IA throughout their architecture, Intel’s new designs are expected to deliver “new levels of performance and energy efficiency” when measured against traditional SoCs.

The new products will also offer multiple functionality and will be custom built for Intel’s traditional computing businesses and core growth areas including Consumer Electronics (CE), Mobile Internet Devices (MIDs), and embedded markets.

“By designing more complex systems onto smaller chips, Intel will scale the performance, functionality and software compatibility of IA while controlling the overall power, cost and size requirements to better meet respective market needs,” commented Gadi Singer, vice president of Intel’s Mobility Group and general manager of the SoC Enabling Group. “Best of all, customers and consumers will equally benefit.”

Intel offers that all of its new chips will provide “increased performance and energy efficiency,” along with the ability for customisation, which leads to faster development schedules and time-to-market delivery for customers while giving end-users improved innovation, more choice, and lower costs.

Intel also outlines that select models within its inbound integrated designs will include QuickAssist Technology, which simplifies the use and deployment of security and packet accelerators in all Intel-based computer systems. Each System on Chip device is based on Intel’s Pentium M processor, integrated memory controller hub, and a selection of integrated communications and embedded I/O controllers.

“The smart SoC versions with Intel QuickAssist Technology accelerate cryptographic and packet processing for security appliances such as virtual private network (VPN) gateways, firewalls, Unified Threat Management (UTM) and enterprise voice applications such as Voice-over-Internet Protocol (VoIP) and converged access platforms,” explains the company.

The upcoming SoC designs are expected in a range of speeds, power dissipation and commercial/industrial temperature options, which Intel claims will lead to platforms boasting a 45 percent smaller board footprint while also enjoying as much as 34 percent lower power dissipation.

With some 50 customers already equipped with the SoC products, Intel is pushing for initial systems to start appearing before the end of the third quarter, with more penned for release between then and 2010.

One of Intel’s new internally-developed SoC designs set for a reveal in the Consumer Electronics market is the “Canmore” chip (working title), which is presently being prepared for an official unveiling later in 2008. A second-generation “Sodaville” chip is also expected to arrive some time in 2009.

2009 will also see Intel’s embedded product portfolio given a second-generation overhaul, while 2009/2010 will witness the introduction of the chipmaker’s own next-gen platform for MIDs, which is presently known under the moniker of “Moorestown” and will include the “Lincroft”.